Meet the Family • eASIC Nextreme-2 is manufactured on a 45 nm process and offers up to 5.9 millions equivalent logic gates, 16.8 Mb of bRAM at 500 MHz and 32 high-speed transceivers at 6.5 Gbps. • eASIC Nextreme-3 is built on a 28 nm process and provides up to 18 million equivalent logic gates, 56 Mb of bRAM and 52 high-speed transceivers at 12.5 Gbps. • eASIC Nextreme-3S provides up to 52 million equivalent ASIC gates with 124 Mb of true dual port memory with 28 Gbps and 16.3 Gbps high speed transceivers. • easicopy provides a seamless and low risk migration path from eASIC Nextreme-2, eASIC Nextreme-3 or eASIC Nextreme-3S to a lower unit cost cell based ASIC. • Power Advantage eASIC Nextreme devices provide up to 80% lower power consumption than equivalent SRAM FPGAs. • Time Advantage We know that time equals money, with eASIC you can deliver products up to 6 months earlier than a traditional ASIC. • High Performance eASIC Nextreme devices can meet the most demanding performance applications whether they are logic, DSP, data plane or control plane applications. • Low Manufacturing Cost eASIC devices only require one unique mask for customization. This equates in to significantly lower development and manufacturing cost. ![]() ASIC & FPGA Chip Design. •Introduction to ASIC/FPGA IC Design Integrated Circuits (IC). Core Generator CORE Generator Tool. Triad Semiconductor. The Mixed Signal ASIC Company. Trusted IC Production Partner; ASIC Integration Benefits. Watchman Core Module iCE40. ![]() The savings versus traditional ASICs can be in the multiple millions of dollars. • Low Unit Cost eASIC devices only use the silicon area that you really need for your design, not more. Our customers have saved in excess of $100’s million versus expensive FPGAs. • Fast Turnaround We well know that customers may change their mind adding the new feature last minute. EASIC’s fast turnaround time enables you to plan for multiple chip revision at a fraction of the cost and time of an ASIC, meeting or exceeding your customers’ needs. What is the Difference Between a FPGA and an ASIC? Field Programmable Gate Arrays (FPGAs) and Application Specific Integrated Circuits (ASICs) provide different values to designers, and they must be carefully evaluated before choosing any one over the other. Information abounds that compares the two technologies. While FPGAs used to be selected for lower speed/complexity/volume designs in the past, today’s FPGAs easily push the 500MHz performance barrier. With unprecedented logic density increases and a host of other features, such as embedded processors, DSP blocks, clocking, and high-speed serial at ever lower price points, FPGAs are a compelling proposition for almost any type of design. ASIC Design Advantages FPGA Design Advantage Benefit Faster time-to-market No layout, masks or other manufacturing steps are needed No upfront non-recurring expenses (NRE) Costs typically associated with an ASIC design Simpler design cycle Due to software that handles much of the routing, placement, and timing More predictable project cycle Due to elimination of potential re-spins, wafer capacities, etc. Field reprogramability A new bitstream can be uploaded remotely ASIC Design Advantage Benefit Full custom capability For design since device is manufactured to design specs Lower unit costs For very high volume designs Smaller form factor Since device is manufactured to design specs.
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